Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor

Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor

  • November 10, 2022

Shuwen Chen, Shicheng Fan, Jiaming Qi, Ze Xiong, Zheng Qiao, Zixiong Wu, Joo Chuan Yeo, Chwee Teck Lim*

 

Abstract
Human-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm−1), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of ≈200 µm. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.

 

Link [Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor]